Client Overview
A semiconductor packaging and wafer-bumping company undertaking capital expansion
Engagement Scope
Grant advisory and application management for semiconductor packaging and wafer-bumping capital expansion
Challenge
The client and its subsidiary required grant funding to support major capital expansion activities in semiconductor packaging and wafer-bumping operations.
Our Approach
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Prepared and managed MIDA grant applications for the client and its subsidiary
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Coordinated documentation and submissions
Deliverables
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MIDA grant application preparation for parent company
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MIDA grant application preparation for subsidiary
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Application coordination and submission management
Outcome
Successfully secured RM10 million in grant funding.
Capabilities Demonstrated
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Government grant advisory
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MIDA grant applications
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Multi-entity coordination (parent and subsidiary)
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Semiconductor sector grant expertise
Tools / Agencies / Stakeholders
MIDA (Malaysian Investment Development Authority)
Summary
Grant approval via MIDA for major semiconductor expansion activities, enabling capital investment in packaging and wafer-bumping operations.